Industrial grade temperature of 237 degrees TEC1-12712 40*40 45*45 cooler temperature 70 degrees cooling plate

Industrial grade temperature of 237 degrees TEC1-12712 4040 4545 cooler temperature 70 degrees cooling plate

Price: $23.55

Model: ic0A1782
Shipping Weight: 0.2kg
9999 Units in Stock

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(complete orders today,deliverd around 11/07/2024)

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Semiconductor refrigeration chip parameters

Model

Electric current

Voltage

Cooling capacity

Temperature difference

Exterior dimension

TypeNumber

Lmax (A)

Max U (V)

Qcmax T=0 (W)

TmaxQC=0 (C)

Dimensions (mm)

TEC1-12712

15.7

115

40*40*3.6

Cooling device-Application selection

Heart of the semiconductor refrigeration products is a semiconductor refrigerator, according to the characteristics of semiconductor thermopile, weaknesses and application scope, the stack should first determine the following questions:
1, Determine the state of the stack. According to the size and direction of current work, can determine the stack cooling, heating and constant temperature performance, although is the most commonly used cooling method, but also should not ignore it by heat and constant temperature performance.
2, To determine when the actual temperature cooling hot end. Because the stack is the difference between the devices, to achieve the best cooling effect, the stack must be installed in a good heat radiator, according to the condition, pay attention to the decision when the actual temperature of refrigeration electric pile, hot end, due to the influence of temperature gradient, stack temperature is compared to the actual temperature of the total end surface temperature the radiator high, usually less zero a few degrees, more than a few degrees higher, ten degrees. In addition, there is a temperature gradient between the cooled space and the cold end of the electric reactor, in addition to the heat sink.
3Determine the working environment and atmosphere of the stack. This includes working in a vacuum or in the general atmosphere, drying nitrogen, static or flowing air and ambient temperature, thereby taking into account the insulation (adiabatic) measures, and determine the effect of heat loss.
4Determine the size of the object and the thermal load of the stack. In addition to the heated end temperature The degree of influence beyond the minimum or maximum temperature thermopile can achieve is determined at no-load and two adiabatic conditions, in fact the stack can not be truly adiabatic, must also have a thermal load, otherwise meaningless.
5Determining the series of cooler. The electric reactor series must meet selected actual temperature requirements, the stack temperature must be higher than the actual nominal temperature requirements, otherwise it is not up to the requirements, but the series is not too much, because the price of stack is greatly enhanced with the increase of series.
6Standard Specification for electric reactor. After the series of the selected stack, the specifications of the stack can be selected, especially the working current of the stack. Because at the same time can satisfy the temperature and cooling the stack there are several, but due to different working conditions, usually choose the smallest current stack, because the power supply cost is small, but the total power of the stack is the deciding factor, input electric power also reduce working current voltage would increase (each of the elements0.1VThus the number of components must be increased.
7Determine the number of stack. This is based on the total power of the reactor to meet the requirements of the temperature difference, it must be guaranteed in the operating temperature of the total power of the reactor cooling capacity is greater than the total power of the work object heat load, otherwise can not meet the requirements. The electric thermal inertia of pile load is very small, not more than a minute, but due to the inertia of load (mainly due to the thermal load capacity, so the actual cause) to reach the set temperature of the working speed is much more than a minute, time up to several hours. If the work speed is larger and the number of stack is the total power of the thermal load is the leakage of heat by the total heat capacity plus (the lower the temperature is, the greater the heat leakage).
The seven aspect is the general principle of selecting stack, according to the original user should first according to the request to choose cooling device. General requirements:
Ambient temperature for a givenThC
The low temperature of a space or object being cooledTcC
Known heat loadQ(thermal powerQpHeat leakQt)W
KnownTh,TcandQAccording to the characteristic curve of the thermoelectric cooler, the number of the required stack and stack can be estimated.
1Determine the model specifications of the cooler

2After the inspection, selected models, thermoelectric characteristic curve of the model.

3By using the environment temperature and the heat radiation way to determine the hot end temperature of the cooler.Th, come to a closeTc.

4And in the corresponding characteristic curve to find out the cold endQcCooling capacity.

5By the required cooling capacityQDividing the cooling capacity of each stackQcGet the required amount of the stack.N=Q/Qc As a kind of special cold source, the semiconductor cooler has the following advantages and characteristics in the technical application:

1, Don't need any refrigerant, continuous work, no pollution no rotating parts, does not produce the gyroscopic effect, no sliding parts is a solid device, when no vibration, noise, long life, easy installation.

2, The semiconductor cooler has two functions, not only can refrigeration, heating, cooling efficiency is generally not high, but the thermal efficiency is high, more than ever1. The use of a device can replace a separate heating system and cooling system.

3, The semiconductor cooler is current in devices, by controlling the input current, which can achieve high precision temperature control, coupled with the temperature detection and control method, is easy to realize remote control, program control, computer, easy to form an automatic control system.

4, Thermoelectric cooler thermal inertia is very small, the cooling and heating time soon, in the hot end heat well under the condition of no-load cold end, electricity is less than a minute, cooler can reach the maximum temperature difference.

5, The reverse use of semiconductor cooler is the thermoelectric power generation, and the semiconductor cooler is generally suitable for the middle and low temperature zone power generation.

6, Thermoelectric power single cooler for refrigerating element is very small, but the combination of the stack, with the same type of stack combination method and parallel series into a refrigeration system, the power can be large, so the cooling power can be done within a few milliwatts to watts.

7, Temperature range of semiconductor cooler, from normal temperature90CTo negative temperature130CCan be achieved.

The semiconductor refrigeration device heat dissipation is a professional technology, which is the basis of long-term operation of the semiconductor refrigeration device. Good heat dissipation in order to obtain the minimum cold end temperature. The following is a semiconductor cooler cooling ways:

1, Natural heat dissipation.
The thermal conductivity of good material, copper aluminum material made of all kinds of radiators, in still air free heat, easy to use, the disadvantage is too big.

2, Liquid filling and cooling.
With good heat dissipation material made of water tank, cooling method, liquid or water. The disadvantage is that the water is not convenient, the waste is too large, the advantage is small size, the best cooling effect.

3, Forced air cooling.
The working atmosphere is the flowing air, the material used by the radiator and the natural heat radiator are the same, the use is convenient, the volume is smaller than the natural cooling, and the disadvantage is that the noise of the fan is increased.

4, Latent heat dissipation.
The most commonly used is"Heat pipe radiator, it is the use of rapid heat transfer capacity of the latent heat. Semiconductor cooler is the input DC power supply, must be equipped with a dedicated power supply.

1DC power supply. The advantages of DC power supply can be directly used, do not need to switch, the disadvantage is that the voltage current must be applied to the semiconductor cooler, some can be resolved through the series of semiconductor cooler, parallel.
2AC current. This is one of the most common power supply, the use must be rectified to DC to use for refrigerator. The cooling device is low voltage and high current device application when the first blood pressure, rectifier, filter, in order to facilitate the use of some plus temperature measurement, temperature control, current control etc..
3Because the semiconductor cooler is a DC power supply, the power supply ripple factor must be less than10%Otherwise, there is a greater impact on the cooling effect.
4The working voltage and current of the semiconductor cooler must be in line with the needs of the working device, for example, theTEC1-12706T125Device, then127For the refrigeration device,PNThe couple work log, limit voltage coolerV=Galvanic log x0.11,06To allow maximum current value.
5When cold and hot swap, the power must be restored to room temperature at both ends.5Minutes can be broken), otherwise easy to cause circuit damage and ceramic plate of refrigerator.
6Semiconductor cooler power supply of electronic circuits are common, in general, the electronic reference book can be found in the electronic technology.By cold implement-Installation method

There are three methods for the installation of the cooler: welding, bonding, bolt compression and fixation. In the production of concrete which way to install, according to the requirements of the product to be, in general for the three kinds of installation, first of all to use anhydrous alcohol cotton to both ends of the surface scrubbing cooling device mounting surface clean, cold storage plate and a cooling plate should be processed, surface flatness is not greater than0.03mm, and clean, the following is the operation of the three installation process.

1Welding, welding.
The installation method of welding requirements of refrigeration device surface must be metal, cold storage plate and a cooling plate can be on the solder (such as copper cooling plate or cooling plate) when installing the first cold storage board, radiator, cooler (Garwin, temperature and the melting point of the solder in the same) all about mounting surface melting70C-110CLow temperature solder0.1mm. Then the heat radiating plate surface and the mounting surface of the mounting surface of the cooling device, cooling device of the cold storage and cold plate parallel contact and rotating extrusion, ensure the good contact cooling. The installation method is more complex and difficult to maintain, and it is generally used in a special occasion.

2Bonding.
Installation method of adhesive is a kind of adhesive with good heat conduction performance, coated on the mounting surface cooling device and cold storage board, even on the cooling plate. Adhesive thickness0.03mmThe mounting surface of refrigerator, hot and cold storage and cold plate, cooling plate parallel to the extrusion, and gently rotate back and forth to ensure the good contact surface contact, ventilated place24Hours of natural curing. The installation method is generally used in the place where the cooling plate is fixed to the heat sink or the cold storage plate.

3Screw compression fixation.
Stud compression installation for fixing is a layer of uniform heat conduction cooling device, cooling plate, the mounting surface of the radiating plate coated with a thin silicone grease, the thickness of about0.03mm. Then the parallel contact mounting surface mounting surface, cooling device and heat radiating plate surface cooling device of the cold storage and cold plate, and gently rotate back and forth cooler, squeeze excess thermal grease, make sure the contact face is good, then screw the cooling plate and fastening between the cooler, the cold storage board three, fastening force should be uniform, not excessive or too light weight, easy to crush the cooling device, the light is easy to cause the face not to contact. The installation is simple, rapid, convenient maintenance, high reliability, is the most current product application of a method of installation.

More than three installation methods in order to achieve the best cooling effect, between the cooling plate and a cooling plate application of heat insulation material is filled, the fixed screw used for reducing thermal insulation gasket, alternating hot and cold, cold storage depends on the size of plate and a cooling plate for cooling method and cooling power, decided according to the application.

Industrial grade temperature of 237 degrees TEC1-12712 40*40 45*45 cooler temperature 70 degrees cooling plate

Price: $23.55

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Industrial grade temperature of 237 degrees TEC1-12712 4040 4545 cooler temperature 70 degrees cooling plate