Condition:New
Type:Logic ICs
HT025315(12*12)
Product description
The HT (high temperature) series is designed for harsh high temperature environments and long life applications. It is assembled with high-strength bismuth telluride thermoelectric material, high thermal conductivity and high insulation DBC (Direct Bonded Copper) ceramics and high temperature solder. It is suitable for high temperature environments, cold and heat cycles, and industrial-grade product applications. There are more than 400 typical models to choose from. Products with aluminum nitride and double-sided metalized ceramic substrates can be customized.
Product Features
High performance, the maximum temperature difference is more than 67 degrees
High reliability, more than 10 years of normal application life
High temperature resistance, suitable for 100℃ environment
Suitable for occasions with frequent hot and cold shocks
High fine flatness (±0.02mm)
Application field
Precision thermostat
Biological and medical equipment
Test and analysis equipment
Ice water machine and semiconductor air conditioner
CpU and other electronic components cooling
Beauty salon equipment
Installation note
■ Use direct current (DC) power supply; voltage/current should be less than the maximum voltage/current of the device;
■ The cooling fins should be installed on the hot-end radiator before use, generally using fans and radiators or water cooling;
■ Use and store in an environment less than 100°C;
■ Pay attention to the force balance during installation to prevent side pressure or any form of impact;
■ This product is suitable for temperature cycles from 0 to 60°C. If it is applied to a wide range of temperature cycles, corresponding life tests are required;
Quick product selection
1. Determine whether the refrigeration object (space, liquid, solid) has a heat source and what is the heating power;
2. What is the ambient temperature (°C) used and the target temperature (°C) of the refrigerating object; Item 1 and Item 2 quickly determine whether it is appropriate to use semiconductor refrigeration chips.
3. Determine the maximum product size that the product can be applied to. From the perspective of performance, the larger the size, the better the cooling effect;
4. If high cooling power is required, you can consider using multiple pieces in series and parallel;
5. If the input voltage exceeds 12V, it is recommended to consider using a multi-chip series solution;
6. The better the heat dissipation effect, the better the cooling effect;
7. The greater the temperature difference, the lower the cooling efficiency;
The four main performance parameters of the semiconductor refrigerator are:
Maximum current Imax: Refers to the maximum current value when ΔT reaches ΔTmax when ΔT reaches ΔTmax under the condition of constant hot surface temperature Th and load Qc.
Maximum current Umax: refers to the constant hot surface temperature Th, the load Qc is 0, the voltage value when ΔT reaches ΔTmax is the maximum voltage value.
Maximum temperature difference ΔTmax: When the heat absorption of the cold surface is 0, the temperature of the hot surface is constant. When I=Imax, the maximum temperature difference between the cold surface and the hot surface can be reached.
Maximum heat absorption QCmax: constant hot surface temperature, the temperature difference between the cold surface and the hot surface ΔT=0, when I=Imax, the cooling surface can absorb the heat.
Process test items
● Thermoelectric material resistance, thermal resistance, Seebeck coefficient test
● Chip height tolerance
● Metallization layer adhesion test
● Solderability test of metallization layer
● Die PN pole test
● Ceramic chip crack test
● Solder joint welding quality test
● Measurement of the maximum temperature difference, resistance, and maximum cooling capacity of the device
Reliability test standards
● A cold technology refrigeration sheet is tested according to the following standards:
● American military standard: MIL-SDT-883E
● Communication industry standard: Telcordia GR-468
● Test standard for temperature circulator
Reliability test items
● Temperature Cycling
● Thermal Shock Testing
● High Temperature Storage
● Power On/Off Cycling Test
● Reverse Power Cycling Test (Reverse Power Cycling Test)
● Mechanical Shock Testing
● Variable Frequency Vibration Testing
