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- Basic electrical performance index
term order | specialnaturevalue | strip piece |
Maximum temperature difference current | IMax | 5.0A | Th=30C |
Maximum temperature difference voltage | VMax | 15.4V | Th=30C |
Maximum temperature difference | DeltaTMax | More than68C | Qc=0T.h=30C |
Maximum cooling power | QCmax | 41W | DeltaT=0C, Th=30C |
Temperature range | TR | -50~150C | |
Power supply wire | UL1569 20AWG 105Standard tin plated wire,PVCInsulation leather, wire end peeling7.1mmLead solder at one end of the hot surface, lead length to the actual length of the assembly shop, also can be customized according to customer special requirements |
Bear assembly pressure | 98N/cm2 |
Moisture and moisture treatment | All around704Silicone rubber seal |
Storage condition | ambient temperature-10C ~40The relative humidity is not more than80%Storage environment for ventilated and non corrosive gases |
Semiconductor refrigeration device is widely used in electronic, laser, communication, measurement, analysis and other fields of science and technology, also has a considerable application in the civil field. Some examples of practical applications are listed below:
The reference point
- parametric amplifier
The dehumidifier
- low noise amplifier
The electrophoresis cell refrigerator
The electronic package refrigeration
The generator (small)
The vidicon tube cooler
The photomultiplier tube shield
The refrigeration box
The thermostat
The thermostatic bath
The infrared detector
The environment analysis
The wine
The laser diode cooler
- integrated circuit refrigeration
The analysis of thermal characteristics of wafer
- precision equipment refrigeration (laser and microprocessor)
The freezer
The dew point hygrometer
The mechanism of cold - slice
The measurement of thermal density
The thermal cycle system (DNA and blood analyzer)
The biological tissue preparation and storage
The wet chemical process temperature control
The drinking water and beverage cooling
The portable refrigerators and refrigerator system (aircraft, cars, ships, hotels, picnic, pharmaceutical, insulin, mobile phone etc.)
Refrigeration device is a heat handling electronic devices, can maintain a temperature difference across the device, when the temperature reaches 50 degrees Celsius when the Th temperature can be more than 75 DEG C (single stage device), when the thermal heat is continuously removed, heat coming from cold continuous pumping. The rate of pumping is related to the power of the device. The bigger the average power is, the greater the rate is. In order to balance the cooling effect and cost, we need to select the appropriate specifications of the cooling device.
- understanding of specifications main refrigeration device:
1 dimensions: Specifications for devices typically have a square, rectangular and circular, multi device pagoda shaped etc.. The thickness of a single layer device is about 3 - 5mm, double layer or multilayer near 3mm multiple.
The 2 largest production capacity: keep the device hot surface temperature of 27 degrees Celsius (or 50 DEG C) when the maximum pumping heat from the cold. When the actual use of the cooling capacity is usually far less than the value of the. Maximum cooling capacity is generally used to compare the refrigeration capacity of different specifications of the device.
3 the maximum temperature difference voltage: the ability to maintain the temperature difference between the two ends of the size of the device and DC voltage on the device is proportional to the voltage reaches the maximum temperature difference when the temperature is called the maximum voltage, the applied voltage exceeds the voltage after the temperature will decrease. Determination of the maximum temperature difference using the voltage maximum cooling capacity when the voltage of the device when in use should be less than the voltage range, most often used is the maximum voltage of 70%--80%, when the voltage to a small temperature difference can use smaller. At this time, the maximum temperature difference and maximum cooling capacity can be obtained. This parameter indicates the applicable voltage range of the device.
4 current: maximum temperature is an important index for determining the device power, sometimes with resistance value instead of said, is the hot and cold surface temperature 27 OC (temperature for 0) in the current maximum temperature voltage value, current device is generally less than this value, the actual operating current will decrease with the increase of temperature difference, heat surface temperature rise. The value can be compared with the power size of the refrigeration device, in addition to the current range of the device operation.
The selection method
1 in order to choose the refrigeration device specifications to determine the cooling capacity needs, which need to remove heat, if not exactly measured or calculated also by the temperature conditions outside estimates, the estimated value of labeled Qc, if the surface temperature and temperature difference is less than 30 DEG C, which belongs to the conventional refrigeration applications directly with the maximum cooling capacity of 1.5*Qc and refrigeration device specification table 27 C, find the value of similar specifications (+ 5W), according to the current and voltage can be used to choose a suitable refrigeration device.
2 for refrigeration temperature difference of 30 degrees --60 degrees Celsius is very cold application, need to use 2.5*Qc or even higher cooling capacity specifications, because the device characteristics is increased with the temperature difference increases the ability of heat pump heat pump is linear decline.
3 choice of refrigeration device should also be considered to control the cooling conditions, heat dissipation conditions directly affect the temperature of the hot surface of the device, the device needs to constantly pumped out from the hot surface to remove heat, and the device power consumption and heat generation, heat dissipating capacity of its total value equal to Qc+V*I, V*I is the input to the power device, if the heat is not sufficient heat will flow back to the cold end, the cold end temperature, so in the heat dissipation condition is restricted by selecting device cooling effect of small power but are likely to improve.
4 as the choice of a program is a large number of small power devices to replace a small number of large power devices, to obtain the same cooling capacity, the purpose is to increase the heat source area to reduce the heat dissipation power density. A small number of large power devices often require water cooling devices, such as the 12715 work in 12V, when the current is 9A Qc = 10W Th=50 C according to the characteristics of Qh=12*9+10=118W, the quantity of heat, so heat load is large, the air cooling radiator of high demand. The solution can be used 12708 pieces of 2 alternative or the use of water cooling.
More than 5 as an approximation of the simple selection scheme of the lack of practical experience in refrigeration device application designers can quickly close the theme, on the basis of the outline design, and then through the simulation and actual test to determine the final design specifications and the surrounding cooler. For more accurate calculation and design, please feel free to contact our technical staff, we will provide you with more extensive practical experience to help you as far as possible to improve the design.
From outside the refrigerator when inhaled in unit time as heat production capacity, the unit is W. When the material properties of alpha R, NP, K, the device's cooling capacity is related to the current and the temperature difference between the two ends of the device; for different external current and temperature conditions, the cooling capacity is different.
In the refrigerator cold end of the heat balance equation, dQc/dI=0, can be obtained with respect to the current best Qc extreme value when Iq:
IT= NP alpha T1/R Iq=
Relative to the yield of Qc is Qc=0.5 alpha 2T12/R NP - K (T2 - T1)
Further, if the definition of refrigerator in the best current condition of Iq, and the temperature difference across the device is 0 when the cooling capacity of maximum cooling capacity of the device is Qcmax, Qcmax=0.5 alpha NP 2T12/R
It can be seen from the above formula, the maximum cooling capacity is a function of temperature, the maximum yield of the samples given by the company is the maximum cooling capacity of the calibration of the hot surface temperature Th=27
